Socket connector assembly for an electronic package

ABSTRACT

A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims benefit to U.S. Provisional Application No.62/585,268, filed Nov. 13, 2017, titled “CABLE SOCKET CONNECTOR ASSEMBLYFOR AN ELECTRONIC PACKAGE” and claims benefit to U.S. ProvisionalApplication No. 62/632,383, filed Feb. 19, 2018, titled “SOCKETCONNECTOR FOR AN ELECTRONIC PACKAGE”, the subject matter of each areherein incorporated by reference in their entirety.

BACKGROUND OF THE INVENTION

The subject matter herein relates generally to socket connectorassemblies for an electronic package of an electronic system.

The ongoing trend toward smaller, lighter, and higher performanceelectrical components and higher density electrical circuits has led tothe development of surface mount technology in the design of printedcircuit boards and electronic packages. Surface mountable packagingallows for a separable connection of an electronic package, such as anintegrated circuit or a computer processor, to pads on the surface ofthe circuit board rather than by contacts or pins soldered in platedholes going through the circuit board. Surface mount technology mayallow for an increased component density on a circuit board, therebysaving space on the circuit board.

One form of surface mount technology includes socket connectors. Asocket connector may include a substrate with terminals on one side ofthe substrate and an array of conductive solder elements, such as a ballgrid array (BGA), on the opposite side, electrically connected throughthe substrate by conductive pathways through the substrate. Theterminals engage contacts on the electronic package and the solderelements are affixed to conductive pads on a host circuit board, such asa mother board, to electrically join the electronic package with thehost circuit board. Conventional architecture provides the socketconnector between the electronic package and the host circuit board.Electrical paths are defined through the socket connector to the hostcircuit board to drive signals from the bottom of the electronicpackage, through the socket connector into the host circuit board. Suchelectrical paths are then routed to an electrical connector mounted at aseparate location on the host circuit board, such as a high speedelectrical connector. The routing of the circuits between the socketconnector and the high speed electrical connector on the host circuitboard occupies board space on the host circuit board. Additionally, theelectrical performance of the electronic system is reduced by themultiple electrical interfaces between the electronic package and thehigh speed connector on the host circuit board. Conventional systems arestruggling with meeting signal and power output from the electronicpackage because there is a need for smaller size and higher number ofconductors while maintaining good electrical performance through thesystem.

A need remains for a high speed socket connector having improvedelectrical performance.

BRIEF DESCRIPTION OF THE INVENTION

In one embodiment, a socket connector is provided for an electronicsystem including a socket assembly having a socket substrate and socketcontacts terminated to the socket substrate. The socket substrate has anupper surface and a lower surface having a first upper mating area onthe upper surface, a second upper mating area on the upper surface and afirst lower mating area on the lower surface. The socket substrate hassocket substrate conductors on at least one layer of the socketsubstrate with first socket substrate conductors of the socket substrateconductors are at the first upper mating area, second socket substrateconductors of the socket substrate conductors at the second upper matingarea and electrically connected to corresponding first socket substrateconductors, and third socket substrate conductors of the socketsubstrate conductors at the first lower mating area and beingelectrically connected to corresponding first socket substrateconductors. The first socket substrate conductors are configured to beelectrically connected to an electronic package mated to the first uppermating area. The second socket substrate conductors are configured to beelectrically connected to an electrical component mated to the secondupper mating area. The third socket substrate conductors are configuredto be electrically connected to a host circuit board mated to the firstlower mating area. The socket assembly is configured to electricallyconnect the electronic package with both the host circuit board and theelectrical component through corresponding socket substrate conductors.The socket contacts have a base, a terminating end extending from thebase and a mating end extending from the base. The terminating end isterminated to corresponding first socket substrate conductors. Themating end has a spring beam deflectable relative to the base and amating beam at a distal end of the spring beam having a separable matinginterface configured to be terminated to corresponding package contactsof the electronic package.

In another embodiment, a socket connector is provided for an electronicsystem including a socket assembly having a socket substrate and socketcontacts terminated to the socket substrate. The socket substrate has anupper surface and a lower surface with a first upper mating area on theupper surface and a first lower mating area on the lower surface. Thesocket substrate has socket substrate conductors on at least one layerof the socket substrate. First socket substrate conductors of the socketsubstrate conductors include plated vias extending between the firstupper mating area and the second mating area and lower contact pads atthe first lower mating area electrically connected to the correspondingplated vias and configured to be electrically connected to a hostcircuit board by a ball grid array of solder balls. Second socketsubstrate conductors of the socket substrate conductors include uppercontact pads and circuit traces electrically connected to correspondingupper contact pads and routed remote from the first upper mating areafor electrical connection to an electrical component remote from thefirst upper mating area. The socket contacts have a base, a terminatingend extending from the base and a mating end extending from the base.The terminating end is terminated to corresponding socket substrateconductors. The mating end has a spring beam deflectable relative to thebase and a mating beam at a distal end of the spring beam having aseparable mating interface configured to be terminated to correspondingpackage contacts of the electronic package. The first socket substrateconductors electrically connect the electronic package to the hostcircuit board and the second socket substrate conductors electricallyconnect the electronic package to the electrical component.

In another embodiment, an electronic system is provided including a hostcircuit board having host contacts, an electronic package having asubstrate including package contacts and an electronic component on thesubstrate electrically connected to the package contacts and a socketconnector for electrically connecting the electronic package with thehost circuit board. The socket connector includes a socket assembly andan electrical component. The socket assembly includes a socket substratehaving socket substrate conductors and socket contacts. The socketcontacts have a base, a terminating end extending from the base and amating end extending from the base. The terminating end is terminated tocorresponding first socket substrate conductors. The mating end has aspring beam deflectable relative to the base and a mating beam at adistal end of the spring beam having a separable mating interfaceconfigured to be terminated to corresponding package contacts of theelectronic package. First socket substrate conductors of the socketsubstrate conductors electrically connect the electronic package to thehost circuit board and second socket substrate conductors of the socketsubstrate conductors electrically connect the electronic package to theelectrical component.

In a further embodiment, a socket contact is provided for a socketconnector having a base having a front and a rear and a mating endextending from the base. The mating end has a spring beam deflectablerelative to the base. The spring beam extends rearward from the base andupward at an angle to elevate the mating end above the base. The matingend has a mating beam extending forward form the spring beam. The matingbeam has a separable mating interface configured to be terminated to apackage contact of an electronic package. The socket contacts includes amounting tab extending from the front of the base configured to besoldered to a solder pad of a socket substrate to mechanically securethe mounting tab to the socket substrate. The mating interface isaligned vertically above the mounting tab.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of an electronic system having a socketassembly formed in accordance with an exemplary embodiment.

FIG. 2 is a perspective view of a socket contact for the socket assemblyin accordance with an exemplary embodiment.

FIG. 3 is a perspective view of a socket contact for the socket assemblyin accordance with an exemplary embodiment.

FIG. 4 is a perspective view of a socket contact for the socket assemblyin accordance with an exemplary embodiment.

FIG. 5 is a schematic view of the electronic system in accordance withan exemplary embodiment.

FIG. 6 is a perspective view of a portion of the socket assembly showinga socket contact coupled to a socket substrate in accordance with anexemplary embodiment.

FIG. 7 is a cross-sectional view of a portion of the socket assemblyshowing a socket contact coupled to a socket substrate in accordancewith an exemplary embodiment.

FIG. 8 is a perspective view of a portion of the socket assembly showinga socket contact coupled to a corresponding socket substrate conductorin accordance with an exemplary embodiment.

FIG. 9 is a perspective view of a portion of the socket assembly showinga socket contact coupled to a socket substrate in accordance with anexemplary embodiment.

FIG. 10 is a cross-sectional view of a portion of the socket assemblyshowing a socket contact coupled to a socket substrate in accordancewith an exemplary embodiment.

FIG. 11 is a perspective view of a portion of the socket assemblyshowing a socket contact coupled to a corresponding socket substrateconductor in accordance with an exemplary embodiment.

FIG. 12 is a perspective view of a portion of the socket assemblyshowing a socket contact coupled to a socket substrate in accordancewith an exemplary embodiment.

FIG. 13 is a cross-sectional view of a portion of the socket assemblyshowing a socket contact coupled to a socket substrate in accordancewith an exemplary embodiment.

FIG. 14 is a perspective view of a portion of the socket assemblyshowing a socket contact coupled to a corresponding socket substrateconductor in accordance with an exemplary embodiment.

FIG. 15 is a perspective view of a portion of the socket assemblyshowing a socket contact coupled to a socket substrate in accordancewith an exemplary embodiment.

FIG. 16 is a schematic view of the electronic system in accordance withan exemplary embodiment.

FIG. 17 is a schematic view of the electronic system in accordance withan exemplary embodiment.

FIG. 18 is a schematic view of the electronic system in accordance withan exemplary embodiment.

FIG. 19 is a perspective view of a socket contact in accordance with anexemplary embodiment.

FIG. 20 is a side view of a socket contact in accordance with anexemplary embodiment.

FIG. 21 is a top perspective view of the socket connector in accordancewith an exemplary embodiment showing socket contacts mounted to thesocket substrate.

FIG. 22 is a perspective view of a portion of the socket assemblyshowing the socket contact coupled to the socket substrate.

FIG. 23 is a cross-sectional view of a portion of the socket assemblyshowing the socket contact coupled to the socket substrate.

FIG. 24 is a perspective view of a portion of the socket assembly inaccordance with an exemplary embodiment.

FIG. 25 is a cross-sectional view of a portion of the socket assembly inaccordance with an exemplary embodiment.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is an exploded view of an electronic system 100 formed inaccordance with an exemplary embodiment. The electronic system 100includes a socket connector 102 that receives an electronic package 104,such as an integrated circuit. The socket connector 102 includes asocket assembly 106 and one or more electrical components 108. Thesocket assembly 106 is configured to be directly electrically connectedto the electronic package 104. The electrical component 108 isconfigured to be directly electrically connected to the socket assembly106. The socket assembly 106 electrically connects the electronicpackage 104 with the electrical component 108. In an exemplaryembodiment, the socket assembly 106 is coupled to a host circuit board110, such as a motherboard. The socket assembly 106 electricallyconnects the electronic package 104 with the host circuit board 110.

In the illustrated embodiment, the electronic package 104 is coupled tothe top of the socket assembly 106 at a first upper mating area 112,multiple electrical components 108 are coupled to the top of the socketassembly 106 at second and third upper mating areas 114, 115,respectively, and the bottom of the socket assembly 106 is coupled tothe host circuit board 110 at a lower mating area 116. Otherarrangements are possible in alternative embodiments. For example,greater or fewer electrical components 108 may be coupled to the socketassembly 106. Other components may be coupled to the host circuit board110. The electronic system 100 allows connection of the electricalcomponent(s) 108 to the electronic package 104 directly through thesocket assembly 106 as opposed to being electrically connected throughthe host circuit board 110. For example, high speed data signals may berouted through the socket assembly 106 between the electricalcomponent(s) 108 and the electronic package 104 rather than having thehigh speed data signals routed through the socket assembly 106 to thehost circuit board 110 and then through the host circuit board 110 tothe electrical component(s) 108.

The electrical component 108 may be any type of component, such as adata communication device. For example, the electrical component 108 maybe an integrated circuit, such as an application-specific integratedcircuit (ASIC), a chip, a microprocessor, and the like. In other variousembodiments, the electrical component 108 may be an electricalconnector, such as a high speed differential pair receptacle connector,a header connector, a card edge connector, and the like. The electricalconnector may define an interface for interfacing with another matingconnector, such as a cable connector, a paddle card connector, oranother type of mating connector. In other various embodiments, theelectrical component 108 may be a cable assembly configured to beelectrically connected to the socket assembly 106. For example, thecable assembly may include contacts mated to the socket assembly 106 ata separable interface or the cable assembly may include cables solderedto the socket assembly 106. Having the electrical component 108 mounteddirectly to the socket assembly 106 reduces the number of electricalinterfaces along the signal paths between the electronic package 104 andthe electrical component 108 to enhance electrical performance of theelectronic system 100. For example, high speed data signals may betransferred directly from the electronic package 104 to the electricalcomponent 108 through the socket assembly 106 rather than being firstrouted through the host circuit board 110.

In an exemplary embodiment, electrical paths from the electronic package104 to the electrical component 108 pass through the socket assembly 106and are not routed through the host circuit board 110. For example, inthe illustrated embodiment, the electrical paths are high speedelectrical paths routed to the electrical component 108 through thesocket assembly 106 between the first and second upper mating areas 112,114. Other electrical paths, such as low speed electrical paths andpower electrical paths, are routed between the upper mating area 112 andthe lower mating area 116 to electrically connect the electronic package104 and the host circuit board 110. An interface is provided between thesocket assembly 106 and the host circuit board 110, such as a ball gridarray (BGA) having solder balls soldered between the host circuit board110 and corresponding socket substrate conductors on the bottom of thesocket assembly 106. However, other types of interfaces may be utilizedin alternative embodiments, such as a land grid array (LGA). Optionally,the electrical paths between the socket assembly 106 and the hostcircuit board 110 may include high speed electrical paths. Optionally,the socket assembly 106 may include a second lower mating area 118, suchas aligned with the second upper mating area 114, for interfacing withthe host circuit board 110, such as for electrically connecting theelectrical component 108 and the host circuit board 110.

In an exemplary embodiment, the socket assembly 106 includes a socketsubstrate 120 having socket substrate conductors 122 that defineelectrical paths between the electronic package 104 and the electricalcomponent 108 and between the electronic package 104 and the hostcircuit board 110. The socket substrate 120 may be a printed circuitboard and the socket substrate conductors 122 may be circuits, pads,traces (of or within the socket substrate 120), vias, and the like ofthe printed circuit board. The socket assembly 106 includes socketcontacts 124 coupled to the socket substrate 120. The socket contacts124 are electrically connected to corresponding socket substrateconductors 122. The socket contacts 124 are configured to beelectrically connected to the electronic package 104. The socketcontacts 124 may be arranged in an array defining a land grid array(LGA) interface.

The electrical component 108 may be terminated directly to the socketsubstrate conductors 122, such as by soldering to the socket substrateconductors 122. Alternatively, the socket substrate conductors 122 maybe electrically connected to the electrical component 108 usingcontacts, pins, solder balls, conductive elastomeric columns, or otherintervening conductive elements. For example, in an exemplaryembodiment, the socket substrate 120 includes an interface on the topside for electrical connection directly to the electrical component 108,such as an LGA interface, a BGA interface, and the like. As such, thesocket assembly 106 electrically connects the electrical component 108to the top of the socket substrate 120. The electrical component 108 mayadditionally or alternatively be electrically coupled to the bottom ofthe socket substrate 120.

In an exemplary embodiment, the socket connector 102 includes a socketframe 126 that supports components of the socket connector 102. Forexample, the socket frame 126 may support the socket assembly 106. Thesocket frame 126 may support the electronic package 104. The socketframe 126 may support the electrical component 108. The socket frame 126may be used to align the electronic package 104 with the first uppermating area 112 for mating the electronic package 104 with the socketassembly 106. For example, frame walls 128 of the socket frame 126 maysurround a socket opening 170 that receives the electronic package 104and the frame walls 128 may orient and align the electronic package 104in one or more directions. In an exemplary embodiment, the socket frame126 may limit or stop compression of the compressible interface toprevent damage to various components. The socket frame 126 may holdvarious components together for mounting to other components. The socketframe 126 may receive the socket substrate 120 or alternatively, may bemounted to the top of the socket substrate 120. For example, theelectronic package 104 may be pre-assembled to the socket frame 126 andthe socket substrate 120 prior to mounting the socket assembly 106 tothe host circuit board 110.

In an exemplary embodiment, the electronic system 100 includes a heatsink 130 for dissipating heat from one or more of the components of theelectronic system 100, such as from the electronic package 104 and/orthe electrical component(s) 108 and/or the socket assembly 106 and/orthe host circuit board 110. Optionally, the heat sink 130 may be mountedto the host circuit board 110 and/or a mounting block 132 below the hostcircuit board 110. For example, the heat sink 130 may be secured to themounting block 132 using fasteners. Optionally, the components mayinclude one or more compressible interfaces therebetween. For example,the socket contacts 124 may define a separable, compressible interfacewith the electronic package 104. The socket contacts 124 may be springbiased against the electronic package 104 when the heat sink 130 iscoupled to the mounting block 132.

FIG. 2 is a perspective view of a socket contact 140 in accordance withan exemplary embodiment. The socket contact 140 may be used as one ormore of the socket contacts 124 (shown in FIG. 1) and is thus anexemplary embodiment of one of the socket contacts 124. As such thesocket contacts 124 may include any or all of the features of the socketcontact 140 described herein. The socket contact 140 extends between aterminating end 200 and a mating end 202. The socket contact 140 has abase 204 configured to be mounted to the socket substrate 120 (shown inFIG. 1). The mating end 202 extends from the base 204 and is configuredto be mated with the electronic package 104 (shown in FIG. 1). Theterminating end 200 extends from the base 204 and is configured to beterminated to the socket substrate 120.

In the illustrated embodiment, the terminating end 200 includes acompliant beam 206, such as an eye-of-the-needle contact, configured tobe press-fit into a plated via of the socket substrate 120. Thecompliant beam 206 may be soldered to the socket substrate 120 tomechanically and/or electrically connect the terminating end 200 to thesocket substrate 120. Other types of terminating ends 200 may beprovided in alternative embodiments. In an exemplary embodiment, theterminating end 200 includes one or more mounting tabs 208 extendingfrom the base 204 at the terminating end 200. For example, in theillustrated embodiment, the terminating end 200 includes two mountingtabs 208 at opposite sides of the socket contacts 140. The mounting tabs208 are configured to engage the socket substrate 120 to mount thesocket contact 140 on the socket substrate 120. The mounting tabs 208may be soldered to the socket substrate 120 to mechanically and/orelectrically connect the terminating end 200 to the socket substrate120.

The mating end 202 includes a spring beam 210 extending from the base204. The spring beam 210 is deflectable. In the illustrated embodiment,the spring beam 210 includes two beam arms 212 separated by a gap 214.However, the spring beam 210 may have other shapes in alternativeembodiments, including a single beam arm 212. Optionally, the springbeam 210 may be centered on the socket contact 140. In variousembodiments, the spring beam 210 may be aligned with the compliant beam206. In an exemplary embodiment, the socket contact 140 includes amating beam 216 at the distal end thereof defining a mating interface218 for mating with the electronic package 104. In an exemplaryembodiment, the mating interface 218 is a separable mating interface.The spring beam 210 may be resiliently deflected during loading tospring bias the mating beam 216 against the electronic package 104 toensure electrical connection between the socket contact 140 and theelectronic package 104. Optionally, the mating interface 218 may beapproximately aligned over the base 204 and/or the complaint beam 206such that the compressive forces are centered over and press in thedirection of the base 204 and/or the compliant beam 206, such as toreduce tilting or rotating the compliant beam 206 in the plated via. Themating end 202 may have other shapes and features in alternativeembodiments. For example, the mating end 202 may include a solder tailor solder tab at the mating end 202 configured to be soldered to theelectronic package 104.

FIG. 3 is a perspective view of a socket contact 142 in accordance withan exemplary embodiment. The socket contact 142 may be used as one ormore of the socket contacts 124 (shown in FIG. 1) and is thus anexemplary embodiment of one of the socket contacts 124. As such thesocket contacts 124 may include any or all of the features of the socketcontact 142 described herein. The socket contact 142 may be similar tothe socket contact 140 (shown in FIG. 2). In the illustrated embodiment,the socket contact 142 is a surface mount contact whereas the socketcontact 140 is a press-fit socket contact. The socket contact 142extends between a terminating end 220 and a mating end 222. The socketcontact 142 has a base 224. The mating end 222 extends from the base 224and is configured to be terminated to the electronic package 104 (shownin FIG. 1). The terminating end 220 extends from the base 224 and isconfigured to be terminated to the socket substrate 120 (shown in FIG.1).

In an exemplary embodiment, the terminating end 220 includes one or moremounting tabs 228 extending from the base 224 at the terminating end220. For example, in the illustrated embodiment, the terminating end 220includes two mounting tabs 228 at opposite sides of the socket contacts142 and a central mounting tab 228 defining a solder tab configured tobe soldered to the socket substrate 120. The mounting tabs 228 areconfigured to engage the socket substrate 120 to mount the socketcontact 142 on the socket substrate 120. Optionally, all of the mountingtabs 228 may be soldered to the socket substrate 120 to mechanicallyand/or electrically connect the terminating end 220 to the socketsubstrate 120.

Optionally, the mating end 222 may be identical to the mating end 202(shown in FIG. 2) of the socket contact 140. The socket contact 142includes a spring beam 230 extending from the base 224 at the mating end222. The spring beam 230 is deflectable. In the illustrated embodiment,the spring beam 230 includes two beam arms 232 separated by a gap 234.However, the spring beam 230 may have other shapes in alternativeembodiments, including a single beam arm 232. In an exemplaryembodiment, the socket contact 142 includes a mating beam 236 at thedistal end thereof defining a mating interface 238 for mating with theelectronic package 104. In an exemplary embodiment, the mating interface238 is a separable mating interface. The spring beam 230 may beresiliently deflected during loading to spring bias the mating beam 236against the electronic package 104 to ensure electrical connectionbetween the socket contact 142 and the electronic package 104. Themating end 222 may have other shapes and features in alternativeembodiments. For example, the mating end 222 may include a solder tailor solder tab at the mating end 222 configured to be soldered to theelectronic package 104.

FIG. 4 is a perspective view of a socket contact 144 in accordance withan exemplary embodiment. The socket contact 144 may be used as one ormore of the socket contacts 124 (shown in FIG. 1) and is thus anexemplary embodiment of one of the socket contacts 124. As such thesocket contacts 124 may include any or all of the features of the socketcontact 140 described herein. In the illustrated embodiment, the socketcontact 144 is shown as a press-fit socket contact similar to the socketcontact 140 (shown in FIG. 2). However, the socket contact 144 may be asurface mount contact similar to the socket contact 142 (shown in FIG.3) in alternative embodiments. The socket contact 144 extends between aterminating end 240 and a mating end 242. The socket contact 144 has abase 244. The mating end 242 extends from the base 224 and is configuredto be terminated to the electronic package 104 (shown in FIG. 1). Theterminating end 240 extends from the base 244 and is configured to beterminated to the socket substrate 120 (shown in FIG. 1).

The terminating end 240 includes a compliant beam 246, such as aneye-of-the-needle contact, configured to be press-fit into a plated viaof the socket substrate 120. The compliant beam 246 may be soldered tothe socket substrate 120 to mechanically and/or electrically connect theterminating end 240 to the socket substrate 120. Other types ofterminating ends 240 may be provided in alternative embodiments. In anexemplary embodiment, the terminating end 240 includes one or moremounting tabs 248 extending from the base 244 at the terminating end240. For example, in the illustrated embodiment, the terminating end 240includes a single mounting tab at a first side of the socket contacts144. The mounting tabs 248 are configured to engage the socket substrate120 to mount the socket contact 144 on the socket substrate 120.Optionally, the mounting tab 248 may be soldered to the socket substrate120 to mechanically and/or electrically connect the terminating end 240to the socket substrate 120.

The socket contact 144 includes a spring beam 250 extending from thebase 244 at the mating end 242. In the illustrated embodiment, thespring beam 250 is offset relative to the compliant beam 246, such asshifted to a second side of the socket contact 144. The spring beam 250is deflectable. In the illustrated embodiment, the spring beam 250includes a single beam arm 252. However, the spring beam 250 may haveother shapes in alternative embodiments. In an exemplary embodiment, thesocket contact 144 includes a mating beam 256 at the distal end thereofdefining a mating interface 258 for mating with the electronic package104. In an exemplary embodiment, the mating interface 258 is a separablemating interface. The spring beam 250 may be resiliently deflectedduring loading to spring bias the mating beam 256 against the electronicpackage 104 to ensure electrical connection between the socket contact144 and the electronic package 104. The mating end 242 may have othershapes and features in alternative embodiments. For example, the matingend 242 may include a solder tail or solder tab at the mating end 242configured to be soldered to the electronic package 104.

FIG. 5 is a schematic view of the electronic system 100 in accordancewith an exemplary embodiment. FIG. 5 illustrates the socket connector102 mounted to the host circuit board 110 and the electronic package 104coupled to the socket connector 102. For example, the electronic package104 is received in the socket frame 126 and mated to the socket contacts124 on the socket substrate 120. The electronic package 104 iselectrically connected to the host circuit board 110 by the socketcontacts 124 and the corresponding socket substrate conductors 122. Theelectrical component 108 is coupled to the socket substrate 120 andelectrically connected to the electronic package 104 by correspondingsocket substrate conductors 122. In the illustrated embodiment, thesocket contacts 124 include both the first socket contacts 140 and thesecond socket contacts 142 or other types of socket contacts such as thesocket contacts 144. However, in alternative embodiments, the socketcontacts 124 may be entirely first socket contacts 140 or entirelysecond socket contacts 142 or other types of socket contacts such as thesocket contacts 144. In an exemplary embodiment, the first socketcontacts 140 are electrically connected to socket substrate conductors122 that are electrically connected to the host circuit board 110,whereas the second socket contacts 142 are electrically connected tosocket substrate conductors 122 that are electrically connected to theelectrical component 108.

In an exemplary embodiment, the electronic package 104 is an integratedcircuit component, such as an application-specific integrated circuit(ASIC). However, other types of electronic packages may be used inalternative embodiments, such as photonic integrated circuits, chips,processors, memory devices and the like. The electronic package 104includes a substrate 150 having an upper surface 152 and a lower surface154. The electronic package 104 includes package contacts 156 defined bycircuits of the substrate 150. In an exemplary embodiment, the packagecontacts 156 are provided on the lower surface 154. However theelectronic package 104 may additionally or alternatively include thepackage contacts 156 on the upper surface 152. The package contacts 156may include pads, traces, vias, beams, wires or other types of contacts.In the illustrated embodiment, the electronic package 104 includes anelectronic component 158, such as a chip, on the upper surface 152. Theelectronic component 158 may be electrically connected to the packagecontacts 156 through traces or circuits of the substrate 150. In analternative embodiment, rather than having a separate substrate 150 andelectronic component 158, the electronic package 104 may include theelectronic component 158 without the substrate 150 having the packagecontacts 156 on the electronic component 158.

During assembly, the socket connector 102 is positioned above the hostcircuit board 110 and mechanically and electrically connected to anupper surface 160 of the host circuit board 110. For example, a BGA ofsolder balls 162 is used to electrically connect the socket connector102 to the host circuit board 110. During assembly, the electricalcomponent 108 is positioned above the socket substrate 120 andmechanically and electrically connected to the socket substrate 120 atthe second upper mating area 114. For example, the electrical component108 may be soldered to the socket substrate 120, such as using solderballs 164. During assembly, the electronic package 104 is positionedabove the socket assembly 106 and mechanically and electricallyconnected to the socket assembly 106. For example, the electronicpackage 104 may be aligned with the socket opening 170 in the socketframe 126 and coupled to the socket contacts 124. The socket frame 126may align and position the electronic package 104 relative to the socketassembly 106. The electronic package 104 is forced downward onto thesocket contacts 124 to compress the socket contacts 124. For example,the heat sink (shown in FIG. 1) may press downward on the electronicpackage 104. In other various embodiments, the socket frame 126 may beused to press downward on the electronic package 104, such as with aclip or cover. In an exemplary embodiment, the socket frame 126 maylimit compression or downward movement of the electronic package 104,such as to prevent damage or overstress of the socket contacts 124.

The socket substrate 120 may be a printed circuit board and the socketsubstrate conductors 122 may be circuits of the printed circuit board.For example, the socket substrate conductors 122 may include pads,traces (of or within the socket substrate 120), vias, and the likeextending through and/or along one or more layers of and/or within thesocket substrate 120, according to various embodiments. The socketsubstrate 120 includes an upper surface 260 and a lower surface 262. Inan exemplary embodiment, portions of various socket substrate conductors122 may be exposed on the upper surface 260 and portions of varioussocket substrate conductors 122 may be exposed on the lower surface 262.

In an exemplary embodiment, the socket substrate conductors 122 includeupper contact pads 270 on the upper surface 260 at the first uppermating area 112 within the socket opening 170 for electrical connectionwith corresponding socket contacts 124. The upper surface 260 may have asolder mask or other layers at the upper surface 260. Optionally, theupper contact pads 270 may be exposed at the upper surface 260 forelectrical connection with the socket contacts 124. In an exemplaryembodiment, the socket substrate conductors 122 include plated vias 272extending at least partially through the socket substrate 120.Optionally, at least some of the plated vias 272 extend entirely betweenthe upper surface 260 and the lower surface 262. The plated vias 272 mayreceive corresponding compliant beams 206 (shown in FIG. 2) forelectrical connection with corresponding socket contacts 140. The platedvias 272 may be associated with corresponding contact pads 270.Alternatively, the plated vias 272 may be provided without the contactpads 270. In an exemplary embodiment, the socket substrate conductors122 include lower contact pads 274 on the lower surface 262 at the firstlower mating area 116 for electrical connection with correspondingsolder balls 162. The lower contact pads 274 are electrically connectedto corresponding plated vias 272.

In an exemplary embodiment, the socket substrate conductors 122 includeupper contact pads 280 on the upper surface 260 at the second uppermating area 114 for electrical connection with the electrical component108, such as through the solder balls 164. The second upper mating area114 is outside of socket opening 170 and remote from first upper matingarea 112. In an exemplary embodiment, the socket substrate conductors122 include plated vias 282 extending at least partially through thesocket substrate 120 between the upper surface 260 and the lower surface262 at the second upper mating area 114 and the second lower mating area118. The plated vias 282 are electrically connected to the electricalcomponent 108 through corresponding upper contact pads 280. In anexemplary embodiment, the socket substrate conductors 122 include lowercontact pads 284 on the lower surface 262 at the second lower matingarea 118 for electrical connection with corresponding solder balls 162.The lower contact pads 284 are electrically connected to correspondingplated vias 282.

In an exemplary embodiment, the socket substrate conductors 122 includetraces 290 on one or more layers of and/or within the socket substrate120 according to various embodiments. In order to maximize electricalperformance properties for high speed signal transmission, traces 290may be provided within the socket substrate 120 at a certain depth orvarying depths, according to various specific embodiments. The traces290 extend between the first upper mating area 112 and the second uppermating area 114. The traces 290 are electrically connected tocorresponding upper contact pads 270 and upper contact pads 280. Thetraces 290 electrically connect the electronic package 104 and theelectrical component 108.

In an exemplary embodiment, first electrical paths 292 are definedbetween the electronic package 104 and the host circuit board 110 by thesocket contacts 140, the upper contact pads 270, the plated vias 272,the lower contact pads 274 and the solder balls 162. In an exemplaryembodiment, the first electrical paths 292 are used for power and lowspeed data signal paths. However, the first electrical paths 292 mayadditionally or alternatively be used for high speed data signals. In anexemplary embodiment, second electrical paths 294 are defined betweenthe electronic package 104 and the electrical component 104 by thesocket contacts 142, the upper contact pads 270, the traces 290, theupper contact pads 280 and the solder balls 164. The second electricalpaths 294 may be used for high speed data signals. However, the secondelectrical paths 294 may additionally or alternatively be used for otherpurposes such as low speed data signals, power paths, and the like. Inan exemplary embodiment, third electrical paths 296 are defined betweenthe electrical component 108 and the host circuit board 110 by thesolder balls 164, the upper contact pads 280, the plated vias 282, thelower contact pads 284 and the solder balls 162. The third electricalpaths 296 may be used for power and low speed data signal paths however,the third electrical paths 296 may additionally or alternatively be usedfor high speed data signals.

In an exemplary embodiment, the electrical component 108 is anintegrated circuit 310, such as an application-specific integratedcircuit (ASIC). However, other types of electrical component may be usedin alternative embodiments, such as photonic integrated circuits, chips,processors, memory devices and the like. The electrical component 108includes a substrate 300 having an upper surface 302 and a lower surface304. The electrical component 108 includes package contacts 306. In anexemplary embodiment, the package contacts 306 are provided on the lowersurface 304. However the electronic package 104 may additionally oralternatively include the package contacts 306 on the upper surface 302.The package contacts 306 may include pads, traces, vias, beams, wires orother types of contacts. The package contacts 306 are electricallyconnected to the socket substrate 120 at corresponding socket substrateconductors 122. For example, in the illustrated embodiment, the packagecontacts 306 are soldered to the upper contact pads 280. However, thepackage contacts 306 may be terminated by other means in alternativeembodiments, such as using a LGA, a BGA, press-fit beams, and the like.

FIG. 6 is a perspective view of a portion of the socket assembly 106showing the socket contact 140 coupled to the socket substrate 120. FIG.7 is a cross-sectional view of a portion of the socket assembly 106showing the socket contact 140 coupled to the socket substrate 120. FIG.8 is a perspective view of a portion of the socket assembly 106 showingthe socket contact 140 coupled to the corresponding socket substrateconductor 122. The socket substrate conductor 122 includes the uppercontact pad 270, the plated via 272 and the lower contact pad 274. Thesolder ball 162 is soldered to the lower contact pad 274.

The base 204 of the socket contact 140 is mounted to the upper surface260 of the socket substrate 120. Optionally, a solder mask 312 oranother layer may be provided at the upper surface 260. The mountingtabs 208 extend from the base 204 and are mounted to the socketsubstrate 120. In an exemplary embodiment, the mounting tabs 208 aresoldered to the upper contact pad 270 to mechanically couple the socketcontact 140 to the socket substrate 120 and electrically connect thesocket contact 140 to the socket substrate conductor 122. The compliantbeam 206 extends from the base 204 into the plated via 272. In anexemplary embodiment, the compliant beam 206 is press-fit in the platedvia 272 to mechanically couple the socket contact 140 to the socketsubstrate 120 and electrically connect the socket contact 140 to thesocket substrate conductor 122.

The spring beam 210 extends from the base 204 to position the matingbeam 216 above the socket substrate 120 for electrically connecting tothe electronic package 104 (shown in FIG. 5). The spring beam 210 isdeflectable to compress the mating beam 216 toward the socket substrate120. The socket contact 140 and the socket substrate conductor 122 formparts of the electrical path 292 between the electronic package 104 andthe host circuit board 110 (shown in FIG. 5). For example, theelectrical path 292 extends from the mating beam 216, through the springbeam 210, through the base 204, through the compliant beam 206 and/orthe mounting tab 208, through the upper contact pad 270 and/or theplated via 272, through the lower contact pad 274 and through the solderball 162. Any part of the electrical path 292 may be considered a socketsubstrate conductor 122 or the entire electrical path 292 may beconsidered a socket substrate conductor 122. For example, the uppercontact pad 270 may be considered a socket substrate conductor 122and/or the plated via 272 may be considered a socket substrate conductor122 and/or the lower contact pad 274 may be considered a socketsubstrate conductor 122. As such, the socket contact 140 may beelectrically connected to the host circuit board 110 by one or moresocket substrate conductors 122.

FIG. 9 is a perspective view of a portion of the socket assembly 106showing the socket contact 140 coupled to the socket substrate 120. FIG.10 is a cross-sectional view of a portion of the socket assembly 106showing the socket contact 140 coupled to the socket substrate 120. FIG.11 is a perspective view of a portion of the socket assembly 106 showingthe socket contact 140 coupled to the corresponding socket substrateconductor 122. The socket substrate conductor 122 includes the uppercontact pad 270, the plated via 272, the circuit trace 290 and the uppercontact pad 280.

The base 204 of the socket contact 140 is mounted to the upper surface260 of the socket substrate 120. The mounting tabs 208 extend from thebase 204 and are mounted to the socket substrate 120. In an exemplaryembodiment, the mounting tabs 208 are soldered to the upper contact pad270 to mechanically couple the socket contact 140 to the socketsubstrate 120 and electrically connect the socket contact 140 to thesocket substrate conductor 122. The compliant beam 206 extends from thebase 204 into the plated via 272. In an exemplary embodiment, thecompliant beam 206 is press-fit in the plated via 272 to mechanicallycouple the socket contact 140 to the socket substrate 120 andelectrically connect the socket contact 140 to the socket substrateconductor 122.

In an exemplary embodiment, the plated via 272 is back drilled from thelower surface 262, such as to an area at or near the connection pointwith the compliant beam 206, thus forming a back drilled bore 314.Because the electrical path 294 is routed from the 1^(st) upper matingarea 112 to the 2^(nd) upper mating area 114 there is no need for theplated via 272 to extend to the lower surface 262 of the socketsubstrate 120. Back drilling the plated via 272 removes a length of theplated via 272, such as the bottom portion of the plated via 272. Backdrilling the plated via 272 reduces electrical stub along the signalpath enhancing electrical performance of the socket assembly 106.

The spring beam 210 extends from the base 204 to position the matingbeam 216 above the socket substrate 120 for electrically connecting tothe electronic package 104 (shown in FIG. 5). The spring beam 210 isdeflectable to compress the mating beam 216 toward the socket substrate120. The socket contact 140 and the socket substrate conductor 122 formparts of the electrical path 294 between the electronic package 104 andthe electrical component 108 (shown in FIG. 5). For example, theelectrical path 294 extends from the mating beam 216, through the springbeam 210, through the base 204, through the compliant beam 206 and/orthe mounting tab 208, through the upper contact pad 270 and/or theplated via 272, through the circuit trace 290 and through the uppercontact pad 280. Any part of the electrical path 294 may be considered asocket substrate conductor 122 or the entire electrical path 294 may beconsidered a socket substrate conductor 122. For example, the uppercontact pad 270 may be considered a socket substrate conductor 122and/or the plated via 272 may be considered a socket substrate conductor122 and/or the circuit trace 290 may be considered a socket substrateconductor 122 and/or the upper contact pad 280 may be considered asocket substrate conductor 122. As such, the socket contact 140 may beelectrically connected to the electrical component 108 by one or moresocket substrate conductors 122.

FIG. 12 is a perspective view of a portion of the socket assembly 106showing the socket contact 142 coupled to the socket substrate 120. FIG.13 is a cross-sectional view of a portion of the socket assembly 106showing the socket contact 142 coupled to the socket substrate 120. FIG.14 is a perspective view of a portion of the socket assembly 106 showingthe socket contact 142 coupled to the corresponding socket substrateconductor 122. The socket substrate conductor 122 includes the uppercontact pad 270, the circuit trace 290 and the upper contact pad 280.Because the socket contact 142 does not include a compliant beam, thereis no need for any plated via. Because the electrical path 294 is routedfrom the 1^(st) upper mating area 112 to the 2^(nd) upper mating area114 there is no need for the plated via to extend to the lower surface262 of the socket substrate 120 thus eliminating electrical stub alongthe signal path enhancing electrical performance of the socket assembly106.

The base 224 of the socket contact 142 is mounted to the upper surface260 of the socket substrate 120. The mounting tabs 228 extend from thebase 224 and are mounted to the socket substrate 120. In an exemplaryembodiment, the mounting tabs 228 are soldered to the upper contact pad270 to mechanically couple the socket contact 142 to the socketsubstrate 120 and electrically connect the socket contact 142 to thesocket substrate conductor 122.

The spring beam 230 extends from the base 224 to position the matingbeam 236 above the socket substrate 120 for electrically connecting tothe electronic package 104 (shown in FIG. 5). The spring beam 230 isdeflectable to compress the mating beam 236 toward the socket substrate120. The socket contact 142 and the socket substrate conductor 122 formparts of the electrical path 294 between the electronic package 104 andthe electrical component 108 (shown in FIG. 5). For example, theelectrical path 294 extends from the mating beam 236, through the springbeam 230, through the base 224, through the compliant beam 226 and/orthe mounting tab 228, through the upper contact pad 270, through thecircuit trace 290 and through the upper contact pad 280. Any part of theelectrical path 294 may be considered a socket substrate conductor 122or the entire electrical path 294 may be considered a socket substrateconductor 122. For example, the upper contact pad 270 may be considereda socket substrate conductor 122 and/or the circuit trace 290 may beconsidered a socket substrate conductor 122 and/or the upper contact pad280 may be considered a socket substrate conductor 122. As such, thesocket contact 142 may be electrically connected to the electricalcomponent 108 by one or more socket substrate conductors 122.

FIG. 15 is a perspective view of a portion of the socket assembly 106showing the socket contact 144 coupled to the socket substrate 120. Thebase 244 of the socket contact 144 is mounted to the upper surface 260of the socket substrate 120. The mounting tabs 248 extend from the base244 and are mounted to the socket substrate 120. In an exemplaryembodiment, the mounting tabs 248 are soldered to the upper contact pad270 to mechanically couple the socket contact 144 to the socketsubstrate 120 and electrically connect the socket contact 144 to thesocket substrate conductor 122. The compliant beam 246 extends from thebase 244 into the plated via 272 to mechanically couple the socketcontact 144 to the socket substrate 120 and electrically connect thesocket contact 144 to the socket substrate conductor 122.

FIG. 16 is a schematic view of the electronic system 100 in accordancewith an exemplary embodiment. FIG. 16 illustrates the socket connector102 mounted to the host circuit board 110 and the electronic package 104coupled to the socket connector 102 similar to the embodimentillustrated in FIG. 5. FIG. 16 illustrates the electrical component 108as an electrical connector 320, such as a card edge connector. Theelectrical connector 320 is coupled to the socket substrate 120 andelectrically connected to the electronic package 104 by correspondingsocket substrate conductors 122.

The electrical connector 320 includes a housing 322 having a mating end324 and a mounting end 326. The housing 322 holds contacts 328terminated to the socket substrate 120. In the illustrated embodiment,the housing 322 is a right angle housing having the mating end 324perpendicular to the mounting end 326. For example, the mating end 324may be at a front of the housing 322 and the mounting end 326 may be ata bottom of the housing 322. However, other types of housings 322 may beprovided in alternative embodiments, such as a vertical housing havingthe mating end 324 at the top of the housing 322. The contacts 328 maybe held in the housing 322. Alternatively, the contacts 328 may be partof stacked contact modules received in the housing 324.

The electrical connector 320 is configured to be mated with a matingelectrical connector 330. In the illustrated embodiment, the electricalconnector 320 is a receptacle connector and the mating electricalconnector 330 is a plug connector. The mating electrical connector 330may be a cable connector having a plurality of cables 332. In theillustrated embodiment, the cables 332 are terminated to a paddle card334 held in a housing 336 of the mating electrical connector 330. Thepaddle card 334 is received in a card slot 338 in the housing 322 of theelectrical connector 320 and electrically connected to the contacts 328.Other types of electrical connectors 320 and mating electricalconnectors 330 may be used in alternative embodiments.

In an exemplary embodiment, electrical paths 340 are defined between theelectronic package 104 and the electrical component 108 by the socketcontacts 142, the upper contact pads 270, the traces 290, the uppercontact pads 280 and the contacts 328. The electrical paths 340 may beused for high speed data signals however, the electrical paths 340 mayadditionally or alternatively be used for other purposes such as lowspeed data signals, power paths, and the like.

FIG. 17 is a schematic view of the electronic system 100 in accordancewith an exemplary embodiment. FIG. 17 illustrates the socket connector102 mounted to the host circuit board 110 and the electronic package 104coupled to the socket connector 102 similar to the embodimentillustrated in FIG. 5. FIG. 17 illustrates the electrical component 108as a cable assembly 350, which is attachable to the socket substrate 120and/or host circuit board 110 through, for example, an insulatinghousing and latch assembly (not shown). The cable assembly 350 iscoupled to the socket substrate 120 and electrically connected to theelectronic package 104 by corresponding socket substrate conductors 122.

The cable assembly 350 includes a housing 352 holding a plurality ofcables 354. The housing 352 holds contacts 356 terminated tocorresponding cables 354. The contacts 356 have mating ends 358terminated to the socket substrate 120. For example, the mating ends 358of the contacts 356 are spring biased against the upper contact pads280. Other types of cable assemblies may be used in alternativeembodiments.

In an exemplary embodiment, electrical paths 360 are defined between theelectronic package 104 and the electrical component 108 by the socketcontacts 142, the upper contact pads 270, the traces 290 (of or withinthe socket substrate 120), the upper contact pads 280 and the contacts356. The electrical paths 360 may be used for high speed data signalshowever, the electrical paths 360 may additionally or alternatively beused for other purposes such as low speed data signals, power paths, andthe like.

FIG. 18 is a schematic view of the electronic system 100 in accordancewith an exemplary embodiment. FIG. 18 illustrates the socket connector102 mounted to the host circuit board 110 and the electronic package 104coupled to the socket connector 102 similar to the embodimentillustrated in FIG. 5. FIG. 18 illustrates the electrical component 108as a cable assembly 370, which is attachable to the socket substrate 120and/or host circuit board 110 through, for example, an insulatinghousing and latch assembly (not shown). The cable assembly 370 iscoupled to the socket substrate 120 and electrically connected to theelectronic package 104 by corresponding socket substrate conductors 122.

The cable assembly 370 includes cables 374 having cable conductors 376terminated to the socket substrate 120. For example, the cableconductors 376 may be soldered directly to corresponding upper contactpads 280. Other types of cable assemblies may be used in alternativeembodiments.

In an exemplary embodiment, electrical paths 380 are defined between theelectronic package 104 and the electrical component 108 by the socketcontacts 142, the upper contact pads 270, the traces 290, the uppercontact pads 280 and the cable conductors 376. The electrical paths 380may be used for high speed data signals however, the electrical paths380 may additionally or alternatively be used for other purposes such aslow speed data signals, power paths, and the like.

FIG. 19 is a perspective view of a socket contact 146 in accordance withan exemplary embodiment. FIG. 20 is a side view of the socket contacts146 in accordance with an exemplary embodiment. The socket contact 146may be used as one or more of the socket contacts 124 (shown in FIG. 1)and is thus an exemplary embodiment of one of the socket contacts 124.As such, the socket contacts 124 may include any or all of the featuresof the socket contact 146 described herein. The socket contact 146extends between a terminating end 400 and a mating end 402. The socketcontact 146 has a base 404 configured to be mounted to the socketsubstrate 120 (shown in FIG. 1). The mating end 402 extends from thebase 404 and is configured to be mated with the electronic package 104(shown in FIG. 1). The terminating end 400 extends from the base 404 andis configured to be terminated to the socket substrate 120.

In the illustrated embodiment, the terminating end 400 includes acompliant beam 406, such as an eye-of-the-needle contact, configured tobe press-fit into a plated via of the socket substrate 120. Thecompliant beam 406 may be soldered to the socket substrate 120 tomechanically and/or electrically connect the terminating end 400 to thesocket substrate 120. Other types of terminating ends 400 may beprovided in alternative embodiments.

In an exemplary embodiment, the terminating end 400 includes one or moreside mounting tabs 408 extending from the base 404 at the terminatingend 400. For example, in the illustrated embodiment, the terminating end400 includes two mounting tabs 408 at opposite sides of the socketcontacts 146. The mounting tabs 408 are configured to engage the socketsubstrate 120 to mount the socket contact 146 on the socket substrate120. The mounting tabs 408 may be soldered to the socket substrate 120to mechanically and/or electrically connect the terminating end 400 tothe socket substrate 120. The mounting tabs 408 may provide structuralsupport for the socket contacts 146 on the socket substrate 120, such asto prevent tipping or rolling on the upper surface of the socketsubstrate 120.

The terminating end 400 includes a forward mounting tab 420 extendingfrom the base 404. In the illustrated embodiment, the mounting tab 420is configured to engage the socket substrate 120 to mount the socketcontact 146 on the socket substrate 120. The mounting tab 420 may besoldered to the socket substrate 120 to mechanically and/or electricallyconnect the terminating end 400 to the socket substrate 120. Themounting tab 420 may provide structural support for the socket contacts146 on the socket substrate 120, such as to prevent tipping or rollingon the upper surface of the socket substrate 120. For example, in theillustrated embodiment, the mounting tab 420 includes stabilizing arms422 to prevent horizontal rolling. In the illustrated embodiment, themounting tab 420 is cross-shaped to provide a large surface area forsoldering and to structurally tie the mounting tab 420 into the solder.

The mating end 402 includes a spring beam 410 extending from the base404. The spring beam 410 is deflectable. In the illustrated embodiment,the spring beam 410 includes two beam arms 412 separated by a gap 414.However, the spring beam 410 may have other shapes in alternativeembodiments, including a single beam arm 412. Optionally, the springbeam 410 may be centered on the socket contact 146. In variousembodiments, the spring beam 410 may be aligned with the compliant beam406. In an exemplary embodiment, the spring beam 410 is angled upwardlyaway from the base 404 to elevate the spring beam 410 off of the uppersurface of the socket substrate 120. As such, the spring beam 410 isable to be moved further away from other socket contacts 146 within thearray, such as away from the solder of the adjacent socket contacts 146to prevent short-circuiting and/or allow tighter spacing of the socketcontacts 146.

In an exemplary embodiment, the socket contact 146 includes a matingbeam 416 at the distal end thereof defining a mating interface 418 formating with the electronic package 104. In an exemplary embodiment, themating interface 418 is aligned directly over the mounting tab 420 forstability during loading or compression of the spring beam 410 and themating beam 416. For example, bending moments may be eliminated byaligning the mating interface 418 over the mounting tab 420, such as toreducing tipping of the socket contact 146, such as to reduce stress inthe solder joint. In an exemplary embodiment, the mating interface 418is a separable mating interface. The spring beam 410 may be resilientlydeflected during loading to spring bias the mating beam 416 against theelectronic package 104 to ensure electrical connection between thesocket contact 146 and the electronic package 104. Optionally, themating interface 418 may be approximately aligned over the base 404and/or the mounting tab 420 such that the compressive forces arecentered over and press in the direction of the base 404 and/or themounting tab 420, such as to reduce tilting or rotating the compliantbeam 406 in the plated via or on the upper surface of the socketsubstrate 120. The mating end 402 may have other shapes and features inalternative embodiments. For example, the mating end 402 may include asolder tail or solder tab at the mating end 402 configured to besoldered to the electronic package 104.

FIG. 21 is a top perspective view of the socket connector 102 inaccordance with an exemplary embodiment showing the socket contacts 146mounted to the socket substrate 120. The socket contacts 146 areconfigured to be electrically connected to the BGA of solder balls 162at the bottom of the socket substrate 120. However, some or all of thesocket contacts 146 may be connected to other conductors, such as at thesecond upper mating area 114 (shown in FIG. 5).

In an exemplary embodiment, the socket contacts 146 are terminated tothe upper contact pads 270 on the upper surface 260 at the first uppermating area 112. The compliant beams 406 are received in correspondingplated vias 272. The base 404 and/or the mating tabs 408, 420 aresoldered to the upper contact pads 270. In an exemplary embodiment,having the spring beam 410 angled upward off of the upper surface 260angles the spring beam 410 away from the solder of the socket contacts146 behind the spring beam 410. As such, the spring beam 410 is not atrisk of electrical shorting to the solder of the other socket contact146 and/or the socket contacts 146 may be more densely populated on thesocket substrate 120.

FIG. 22 is a perspective view of a portion of the socket assembly 106showing the socket contact 146 coupled to the socket substrate 120. FIG.23 is a cross-sectional view of a portion of the socket assembly 106showing the socket contact 146 coupled to the socket substrate 120. Thesocket substrate conductor 122 includes the upper contact pad 270, theplated via 272 and the lower contact pad 274. The solder ball 162 issoldered to the lower contact pad 274.

The base 404 of the socket contact 146 is mounted to the upper surface260 of the socket substrate 120. Optionally, the solder mask 312 oranother layer may be provided at the upper surface 260. The mountingtabs 408 extend from the base 404 and are mounted to the socketsubstrate 120. The mounting tabs 408 may be soldered to the socketsubstrate 120. The mounting tab 420 extends from the base 404 and ismounted to the socket substrate 120. In an exemplary embodiment, themounting tab 420 is soldered to the upper contact pad 270 tomechanically couple the socket contact 146 to the socket substrate 120and electrically connect the socket contact 146 to the socket substrateconductor 122. The compliant beam 406 extends from the base 404 into theplated via 272. In an exemplary embodiment, the compliant beam 406 ispress-fit in the plated via 272 to mechanically couple the socketcontact 146 to the socket substrate 120 and electrically connect thesocket contact 146 to the socket substrate conductor 122.

The spring beam 410 extends from the base 404 to position the matingbeam 416 above the socket substrate 120 for electrically connecting tothe electronic package 104 (shown in FIG. 5). The spring beam 410 isdeflectable to compress the mating beam 416 toward the socket substrate120. The socket contact 146 and the socket substrate conductor 122 formparts of the electrical path 292 between the electronic package 104 andthe host circuit board 110 (shown in FIG. 5). For example, theelectrical path 292 extends from the mating beam 416, through the springbeam 410, through the base 404, through the compliant beam 406 and/orthe mounting tab 408, through the upper contact pad 270 and/or theplated via 272, through the lower contact pad 274 and through the solderball 162. Any part of the electrical path 292 may be considered a socketsubstrate conductor 122 or the entire electrical path 292 may beconsidered a socket substrate conductor 122. For example, the uppercontact pad 270 may be considered a socket substrate conductor 122and/or the plated via 272 may be considered a socket substrate conductor122 and/or the lower contact pad 274 may be considered a socketsubstrate conductor 122. As such, the socket contact 146 may beelectrically connected to the host circuit board 110 by one or moresocket substrate conductors 122.

FIG. 24 is a perspective view of a portion of the socket assembly 106showing socket contacts 146 used as an upper socket contact 430 and alower socket contact 432. FIG. 25 is a cross-sectional view of a portionof the socket assembly 106 showing the upper and lower socket contacts430, 432. In an exemplary embodiment, the upper and lower socketcontacts 430, 432 are identical. The upper socket contacts 430 form anarray for mating with the electronic package 104 and the lower socketcontacts form an array for mating with the host circuit board 110. Thesocket substrate conductor 122 includes the upper contact pad 270, theplated via 272 and the lower contact pad 274. In an exemplaryembodiment, the mating beams 416 are oriented such that the matinginterfaces 418 of the upper and lower socket contacts 430, 432 arealigned with each other. In an exemplary embodiment, the mating beams416 are oriented such that the mating interfaces 418 of the upper andlower socket contacts 430, 432 are aligned with the mounting tabs 420.As such, the compressive forces of the upper and lower socket contacts430, 432 are aligned along a vertical axis passing through the mountingtabs 420.

It is to be understood that the above description is intended to beillustrative, and not restrictive. For example, the above-describedembodiments (and/or aspects thereof) may be used in combination witheach other. In addition, many modifications may be made to adapt aparticular situation or material to the teachings of the inventionwithout departing from its scope. Dimensions, types of materials,orientations of the various components, and the number and positions ofthe various components described herein are intended to defineparameters of certain embodiments, and are by no means limiting and aremerely exemplary embodiments. Many other embodiments and modificationswithin the spirit and scope of the claims will be apparent to those ofskill in the art upon reviewing the above description. The scope of theinvention should, therefore, be determined with reference to theappended claims, along with the full scope of equivalents to which suchclaims are entitled. In the appended claims, the terms “including” and“in which” are used as the plain-English equivalents of the respectiveterms “comprising” and “wherein.” Moreover, in the following claims, theterms “first,” “second,” and “third,” etc. are used merely as labels,and are not intended to impose numerical requirements on their objects.Further, the limitations of the following claims are not written inmeans-plus-function format and are not intended to be interpreted basedon 35 U.S.C. § 112(f), unless and until such claim limitations expresslyuse the phrase “means for” followed by a statement of function void offurther structure.

1. A socket connector for an electronic system comprising: a socketassembly comprising a socket substrate and socket contacts terminated tothe socket substrate; the socket substrate having an upper surface and alower surface, the socket substrate having a first upper mating area onthe upper surface and a second upper mating area on the upper surface,the socket substrate having a first lower mating area on the lowersurface, the socket substrate having socket substrate conductors on atleast one layer of the socket substrate, first socket substrateconductors of the socket substrate conductors being at the first uppermating area, second socket substrate conductors of the socket substrateconductors being at the second upper mating area and being electricallyconnected to corresponding first socket substrate conductors, and thirdsocket substrate conductors of the socket substrate conductors being atthe first lower mating area and being electrically connected tocorresponding first socket substrate conductors, the first socketsubstrate conductors configured to be electrically connected to anelectronic package mated to the first upper mating area, the secondsocket substrate conductors configured to be electrically connected toan electrical component mated to the second upper mating area, the thirdsocket substrate conductors configured to be electrically connected to ahost circuit board mated to the first lower mating area; and the socketcontacts each having a base, a terminating end extending from the baseand a mating end extending from the base, the terminating end beingterminated to corresponding first socket substrate conductors, themating end having a spring beam deflectable relative to the base and amating beam at a distal end of the spring beam, the mating beam having aseparable mating interface configured to be terminated to correspondingpackage contacts of the electronic package, wherein the base has a frontand a rear, the spring beam extending rearward from the base and upwardat an angle to elevate the mating end above the base, the mating beamextending forward form the spring beam, the socket contact having amounting tab extending from the front of the base, the mounting tabconfigured to be soldered to corresponding upper contact pads on theupper surface defining the first socket substrate conductors tomechanically secure the mounting tab to the socket substrate, whereinthe separable mating interface of the mating beam is aligned verticallyabove the mounting tab, the terminating ends of at least a plurality ofthe socket contacts each include a compliant beam extending from a rearof the base, the compliant beam being press-fit into correspondingplated vias of the socket substrate defining the first socket substrateconductors; wherein the socket assembly is configured to electricallyconnect the electronic package with both the host circuit board and theelectrical component through corresponding socket substrate conductors.2. (canceled)
 3. (canceled)
 4. The socket connector of claim 1, whereinat least a plurality of the plated vias being back drilled and extendingonly partially through the socket substrate ending remote from the lowersurface.
 5. The socket connector of claim 1, wherein the socket contactscomprise first socket contacts and second socket contacts, the firstsocket contacts comprising compliant beams at the terminating endsextending into corresponding plated vias of the socket substratedefining corresponding first socket substrate conductors, the secondsocket contacts comprising mounting tabs at the terminating endssoldered to corresponding upper contact pads on the upper surfacedefining corresponding first socket substrate conductors, the matingends of the first and second socket contacts being coplanar for matingwith the electronic package.
 6. The socket connector of claim 1, whereinthe second socket substrate conductors extend to the upper surface atthe second upper mating area and the third socket substrate conductorsextend to the lower surface at the first lower mating area.
 7. Thesocket connector of claim 1, wherein the second socket substrateconductors comprise circuit traces on at least one layer of the socketsubstrate routed between the first upper mating area and the secondupper mating area.
 8. The socket connector of claim 1, wherein the thirdsocket substrate conductors comprise plated vias routed between thefirst upper mating area at the upper surface and the first lower matingarea at the lower surface and the third socket substrate conductorscomprise lower contact pads on the lower surface electrically connectedto corresponding plated vias and configured to be electrically connectedto the host circuit board by a ball grid array of solder balls.
 9. Thesocket connector of claim 1, wherein the socket assembly comprises asocket frame holding the socket substrate, the socket frame having framewalls surrounding a socket frame opening configured to receive theelectronic package.
 10. The socket connector of claim 1, wherein thesocket substrate conductors comprise forth socket substrate conductorsextending between the second upper mating area and a second lower matingarea on the lower surface, the fourth socket substrate conductorsconfigured to electrically connect the electrical component and the hostcircuit board.
 11. A socket connector for an electronic systemcomprising: a socket assembly comprising a socket substrate and socketcontacts terminated to the socket substrate; the socket substrate havingan upper surface and a lower surface, the socket substrate having afirst upper mating area on the upper surface and a first lower matingarea on the lower surface, the socket substrate having socket substrateconductors on at least one layer of the socket substrate, wherein firstsocket substrate conductors of the socket substrate conductorscomprising plated vias extending between the first upper mating area andthe first lower mating area and the first socket substrate conductorscomprising lower contact pads at the first lower mating areaelectrically connected to the corresponding plated vias, the lowercontact pads configured to be electrically connected to a host circuitboard by a ball grid array of solder balls, and wherein second socketsubstrate conductors of the socket substrate conductors comprising uppercontact pads and circuit traces electrically connected to correspondingupper contact pads and routed remote from the first upper mating areafor electrical connection to an electrical component remote from thefirst upper mating area; and the socket contacts each having a base, aterminating end extending from the base and a mating end extending fromthe base, the terminating end being terminated to corresponding socketsubstrate conductors, the mating end having a spring beam deflectablerelative to the base and a mating beam at a distal end of the springbeam, the mating beam having a separable mating interface configured tobe terminated to corresponding package contacts of the electronicpackage, wherein the first socket substrate conductors electricallyconnect the electronic package to the host circuit board and the secondsocket substrate conductors electrically connect the electronic packageto the electrical component, wherein the base has a front and a rear,the spring beam extending rearward from the base and upward at an angleto elevate the mating end above the base, the mating beam extendingforward form the spring beam, the socket contact having a mounting tabextending from the front of the base, the mounting tab being crossshaped, the mounting tab configured to be soldered to a contact pad onthe upper surface to mechanically secure the mounting tab to the socketsubstrate, wherein the separable mating interface of the mating beam isaligned vertically above the mounting tab.
 12. The socket connector ofclaim 11, wherein the socket contacts comprise first socket contacts andsecond socket contacts, the first socket contacts being terminated tocorresponding first socket substrate conductors, the first socketcontacts comprising compliant beams at the terminating ends extendinginto corresponding plated vias of the socket substrate, the secondsocket contacts being terminated to corresponding second socketsubstrate conductors, the second socket contacts comprising mountingtabs at the terminating ends soldered to corresponding upper contactpads.
 13. The socket connector of claim 11, wherein the socket substrateincludes a second upper mating area on the upper surface remote from thefirst upper mating area receiving the electrical component, the secondsocket substrate conductors extending between the first upper matingarea and the second upper mating area to electrically connect theelectronic package and the electrical component.
 14. The socketconnector of claim 11, wherein the terminating ends of at least aplurality of the socket contacts each include a compliant beam extendingfrom the base into corresponding plated vias of the socket substrate.15. (canceled)
 16. The socket connector of claim 11, wherein the secondsocket substrate conductors comprise plated vias electrically connectedto corresponding circuit traces, the terminating ends of at least aplurality of the socket contacts have compliant beams press-fit incorresponding plated vias of the second socket substrate conductors, theplated vias of the second socket substrate conductors being back drilledand extending only partially through the socket substrate ending remotefrom the lower surface.
 17. An electronic system comprising: a hostcircuit board having host contacts; an electronic package having asubstrate including package contacts and an electronic component on thesubstrate electrically connected to the package contacts; and a socketconnector for electrically connecting the electronic package with thehost circuit board, the socket connector comprising a socket assemblyand an electrical component, the socket assembly including a socketsubstrate and socket contacts, the socket substrate having socketsubstrate conductors, the socket contacts each having a base, aterminating end extending from the base and a mating end extending fromthe base, the terminating end being terminated to corresponding socketsubstrate conductors, the mating end having a spring beam deflectablerelative to the base and a mating beam at a distal end of the springbeam, the mating beam having a separable mating interface configured tobe terminated to corresponding package contacts of the electronicpackage, wherein first socket substrate conductors of the socketsubstrate conductors electrically connect the electronic package to thehost circuit board and wherein second socket substrate conductors of thesocket substrate conductors electrically connect the electronic packageto the electrical component; wherein the base has a front and a rear,the spring beam extending rearward from the base and upward at an angleto elevate the mating end above the base, the mating beam extendingforward form the spring beam, the socket contact having a mounting tabextending from the front of the base, the mounting tab configured to besoldered to a solder pad of the corresponding first socket substrateconductor to mechanically secure the mounting tab to the socketsubstrate, wherein the separable mating interface of the mating beam isaligned vertically above the mounting tab, the terminating ends of atleast a plurality of the socket contacts each include a compliant beamextending from a rear of the base, the compliant beam being press-fitinto corresponding plated vias of the socket substrate defining thefirst and second socket substrate conductors.
 18. (canceled) 19.(canceled)
 20. The electronic system of claim 17, wherein the socketcontacts comprise first socket contacts and second socket contacts, thefirst socket contacts comprising compliant beams at the terminating endsextending into corresponding plated vias of the socket substratedefining corresponding socket substrate conductors, the second socketcontacts comprising mounting tabs at the terminating ends soldered tocorresponding upper contact pads on the upper surface definingcorresponding socket substrate conductors, the mating ends of the firstand second socket contacts being coplanar for mating with the electronicpackage.
 21. A socket contact for a socket connector, the socket contactcomprising: a base having a front and a rear; a mating end extendingfrom the base, the mating end having a spring beam deflectable relativeto the base, the spring beam extending rearward from the base and upwardat an angle to elevate the mating end above the base, the mating endhaving a mating beam extending forward form the spring beam, the matingbeam having a separable mating interface configured to be terminated toa package contact of an electronic package; a mounting tab extendingfrom the front of the base, the mounting tab configured to be solderedto a solder pad of a socket substrate to mechanically secure themounting tab to the socket substrate, and a compliant beam extendingfrom the rear of the base, the compliant beam configured to be press fitin a via of the socket substrate; wherein the mating interface isaligned vertically above the mounting tab.
 22. The socket contact ofclaim 21, wherein the mounting tab includes stabilizing arms extendingtherefrom to prevent rolling of the socket contact.
 23. A socket contactfor a socket connector, the socket contact comprising: a base having afront and a rear; a mating end extending from the base, the mating endhaving a spring beam deflectable relative to the base, the spring beamextending rearward from the base and upward at an angle to elevate themating end above the base, the mating end having a mating beam extendingforward form the spring beam, the mating beam having a separable matinginterface configured to be terminated to a package contact of anelectronic package; a mounting tab extending from the front of the base,the mounting tab configured to be soldered to a solder pad of a socketsubstrate to mechanically secure the mounting tab to the socketsubstrate, wherein the mounting tab is cross-shaped, wherein the matinginterface is aligned vertically above the mounting tab.
 24. The socketcontact of claim 23, further comprising a compliant beam extending fromthe rear of the base, the compliant beam configured to be press fit in avia of the socket substrate.
 25. The socket connector of claim 1,wherein the mounting tab includes stabilizing arms extending therefromto prevent rolling of the socket contact.
 26. The socket connector ofclaim 1, wherein the mounting tab is cross-shaped.
 27. The socketconnector of claim 1, wherein data signals are transmitted between thefirst and second socket substrate conductors.
 28. The socket connectorof claim 1, wherein power is transmitted between the first and secondsocket substrate conductors.
 29. The socket connector of claim 11,wherein the mounting tab includes stabilizing arms extending therefromto prevent rolling of the socket contact.
 30. The electronic system ofclaim 17, wherein the mounting tab includes stabilizing arms extendingtherefrom to prevent rolling of the socket contact.
 31. The electronicsystem of claim 17, wherein the mounting tab is cross-shaped.